Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight 1d —
Cap-weighted 1d —
Momentum (drift) 1d —
Constituents in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap; below ten names the cap is infeasible, so the sub-index is equal weight by construction) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
NDSNNordsonUS311.74+0.88%+1.40%+2.48%+7.42%+16.87%+38.76%USD
042700.KSHanmi SemiconductorKorea225500.00-0.22%-10.87%+2.04%-28.53%-25.08%+173.85%KRW
0522.HKASMPTAsia-other160.00-0.81%-3.03%+0.95%-23.37%+48.84%+134.26%HKD
LPK.DELPKF Laser & ElectronicsEurope12.30+2.07%-4.65%-10.22%-56.23%+96.49%+72.75%EUR
KLICKulicke & SoffaUS81.92+3.25%-1.27%-11.01%-29.69%+25.02%+101.70%USD
BESI.ASBESIEurope181.50+1.48%-1.41%-14.47%-43.33%+2.32%+48.73%EUR

FAQ · from the current data · as of 2026-09-17

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-09-17: leading — Nordson (NDSN) +2.48%; Hanmi Semiconductor (042700.KS) +2.04%; ASMPT (0522.HK) +0.95%. Lagging — BESI (BESI.AS) -14.47%; Kulicke & Soffa (KLIC) -11.01%; LPKF Laser & Electronics (LPK.DE) -10.22%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-09-17: Hanmi Semiconductor (042700.KS) +173.85%; ASMPT (0522.HK) +134.26%; Kulicke & Soffa (KLIC) +101.70%. Weakest: Nordson (NDSN) +38.76%; BESI (BESI.AS) +48.73%; LPKF Laser & Electronics (LPK.DE) +72.75%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.